| 纳米碳化硅-镍复合电镀的研究 |
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| 引用本文： | 华小社,王红军,杜宝中,缪叶飞. 纳米碳化硅-镍复合电镀的研究[J]. 西安理工大学学报, 2006, 22(3): 331-334 |
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| 作者姓名： | 华小社 王红军 杜宝中 缪叶飞 |
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| 作者单位： | 1. 西安理工大学,理学院,陕西,西安,710048
2. 西北工业大学,理学院,陕西,西安,710072 |
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| 摘 要： | 采用复合电镀技术在铜基上制备了高硬度、高耐磨的Ni-SiC纳米镀层。研究了阴极电流密度、镀液pH、温度以及搅拌速度对复合沉积层的显微硬度和共沉积速率的影响,同时优化了各工艺参数,并对Ni-SiC纳米复合镀层进行了表面形貌和能谱分析。实验结果表明,Ni-SiC纳米复合电镀层表面平整光滑,显微组织均匀、致密,其显微硬度也较纯镍镀层有显著提高。
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| 关 键 词： | 纳米 Ni-SiC复合电镀 显微硬度 表面形貌 |
| 文章编号： | 1006-4710(2006)03-0331-04 |
| 收稿时间： | 2006-03-10 |
| 修稿时间： | 2006-03-10 |
A Study of Ni-SiC Nano-Composite Plating Process |
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| HUA Xiao-she,WANG Hong-jun,DU Bao-zhong,MIAO Ye-fei. A Study of Ni-SiC Nano-Composite Plating Process[J]. Journal of Xi'an University of Technology, 2006, 22(3): 331-334 |
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| Authors: | HUA Xiao-she WANG Hong-jun DU Bao-zhong MIAO Ye-fei |
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| Abstract: | Ni-based coatings with nanometer SiC powder were made on copper substrate.The effects of cathodic current density,plating solution,pH value and temperature on the micro-hardness of Ni-SiC nano-composite coating and co-deposition rate are analyzed.And at the same time process parameters are optimized,and the surface morphology and energy spectrum of the Ni-SiC nano-composite coating are also analyzed.The experiment results show that the Ni-SiC nano-composite coating has a flat morphology and compact microstructure,and its micro-hardness is remarkably improved as compared with that of pure nickel coating. |
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| Keywords: | nanometer Ni-SiC composite plating micro-hardness surface morphology |
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