中温潜伏性固化剂在环氧胶黏剂中的研究进展

在环氧胶黏剂体系中,中温潜伏性固化剂以其优异的潜伏性和相对较低的固化温度而成为研究热点,符合当下提倡的绿色、环保、"低碳生活"理念。详细介绍了双氰胺、咪唑、酸酐、有机酰肼、BF3-胺络合物、微胶囊六种中温潜伏性固化剂及其改性方法。它们的改性方法主要是:通过改性活化或者加入活性促进剂降低双氰胺、酸酐、有机酰肼等高温固化剂的固化温度;通过改性钝化咪唑的固化活性,延长室温储存期;将BF3等路易斯酸室温固化的固化剂与胺络合降低其固化活性,提高室温储存期;将活性固化剂用壁材包裹形成微胶囊使其在室温时稳定,较高的温度时壁材破裂释放出活性固化剂,迅速固化。

The Progress in Research on the Moderate Temperature Latent Curing Agent for Epoxy Adhesives

The moderate latent curing agents become the research hotspot which is applied in epoxy adhesives for its excellent latent and relative low curing temperature which meets the current concepts of green （demand of no pollution）, environmentally friendly, ＂low-carbon life＂. Dicyandiamide, imidazole, anhydride, organic hydrazine, BF3-amine complex, microcapsules and main methods of their modification are introduced in detail. The main methods of their modification are as follows： modification or adding active promoter to reduce curing temperature of dicyandiamide, acid anhydride, organic hydrazine; passivating the curing activity of imidazole to extend the storage period at room temperature; complexing the Lewis acid room temperature curing agent such as BF3 with amine to reduce the curing activity and prolong the storage life at room temperature; packing the active curing agents with wall materials to form microcapsules to make them be stable at room temperature and rupture at high temperature, then the activity of curing agent will be released and curing fast.