| HIT太阳能电池导电银浆的制备与性能研究 |
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| 引用本文： | 李森,金理福,许巍,袁晓,李欣欣.HIT太阳能电池导电银浆的制备与性能研究[J].医学教育探索,2015(6):787-791. |
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| 作者姓名： | 李森 金理福 许巍 袁晓 李欣欣 |
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| 作者单位： | 华东理工大学材料科学与工程学院, 特种功能高分子材料及相关技术教育部重点实验室, 上海 200237,华东理工大学材料科学与工程学院, 特种功能高分子材料及相关技术教育部重点实验室, 上海 200237,华东理工大学材料科学与工程学院, 特种功能高分子材料及相关技术教育部重点实验室, 上海 200237,华东理工大学材料科学与工程学院, 特种功能高分子材料及相关技术教育部重点实验室, 上海 200237,华东理工大学材料科学与工程学院, 特种功能高分子材料及相关技术教育部重点实验室, 上海 200237 |
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| 基金项目： | 国家高技术研究发展("863")计划(2014AA0521012) |
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| 摘 要： | 介绍了用于异质结(HIT)太阳能电池电极印刷材料——低温固化导电银浆的制备方法,并系统讨论了银粉形貌、基体树脂可靠性、触变剂等对HIT银浆性能的影响。通过对银浆体电性能、耐老化性、流变性、印刷性以及焊接性的研究,结果显示:3~4μm的片型银粉具有良好的导电性与印刷通过性,以酚醛型环氧树脂作为黏结相可以使导电银浆具有耐高温、耐候性,银浆经过触变调整后,可以印制线型良好、体电阻较小的栅线,并可以经受焊接和室外长期使用。
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| 关 键 词： | HIT 银粉 电阻 流变性 焊接 |
| 收稿时间： | 2015/3/20 0:00:00 |
Preparation and Properties of Conductive Silver Paste for HIT Solar Cell |
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| LI Sen,JIN Li-fu,XU Wei,YUAN Xiao and LI Xin-xin.Preparation and Properties of Conductive Silver Paste for HIT Solar Cell[J].Researches in Medical Education,2015(6):787-791. |
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| Authors: | LI Sen JIN Li-fu XU Wei YUAN Xiao and LI Xin-xin |
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| Affiliation: | Key Laboratory for Specially Functional Polymeric Materials and Related Technology of the Ministry of Education, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, China,Key Laboratory for Specially Functional Polymeric Materials and Related Technology of the Ministry of Education, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, China,Key Laboratory for Specially Functional Polymeric Materials and Related Technology of the Ministry of Education, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, China,Key Laboratory for Specially Functional Polymeric Materials and Related Technology of the Ministry of Education, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, China and Key Laboratory for Specially Functional Polymeric Materials and Related Technology of the Ministry of Education, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, China |
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| Abstract: | |
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| Keywords: | HIT silver resistivity rheology welding |
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