首页 | 官方网站   微博 | 高级检索  
     

降冰片烯酰亚胺型双苯并嗪的合成及性能
引用本文:袁伟,史铁钧,钱莹,陈杨.降冰片烯酰亚胺型双苯并嗪的合成及性能[J].化工学报,2016,67(11):4899-4905.
作者姓名:袁伟  史铁钧  钱莹  陈杨
作者单位:合肥工业大学化学与化工学院, 安徽 合肥 230009
基金项目:国家自然科学基金项目(51273054)。
摘    要:首先用降冰片烯二酸酐、对氨基苯酚为原料合成降冰片烯酰亚胺(NI),然后用合成的NI、4,4-二氨基二苯醚(ODA)和多聚甲醛为原料进行Mannich反应合成出降冰片烯酰亚胺型双苯并嗪(NI-BOZ),经高温固化后形成热固性树脂。用FTIR、1H NMR、13C NMR分析了NI和NI-BOZ的化学结构,证实了所得的目标产物;用DSC对NI-BOZ的固化动力学进行研究;用DMA和TGA分析了NI-BOZ的固化物的热性能。结果表明:NI-BOZ的固化反应活化能为86.27 kJ·mol-1,反应级数为0.91;poly(NI-BOZ)树脂空气条件下的玻璃化转变温度为215℃,氮气条件下失重5%的温度为445℃,失重10%的温度为467℃,在800℃的残碳率为63%。

关 键 词:降冰片烯酰亚胺  苯并嗪  合成  核磁共振  热性能  热固性树脂  
收稿时间:2016-01-19
修稿时间:2016-06-14

Preparation and properties of norbornene-imide-functionalized bis-benzoxazine
YUAN Wei,SHI Tiejun,QIAN Ying,CHEN Yang.Preparation and properties of norbornene-imide-functionalized bis-benzoxazine[J].Journal of Chemical Industry and Engineering(China),2016,67(11):4899-4905.
Authors:YUAN Wei  SHI Tiejun  QIAN Ying  CHEN Yang
Affiliation:School of Chemistry and Chemical Engineering, Hefei University of Technology, Hefei 230009, Anhui, China
Abstract:Norbornene imide (NI), which was prepared from carbic anhydride and p-aminophenol, together with 4,4-2 amino diphenyl ether (ODA) and paraformaldehyde, was used to synthesize norbornene-imide-functionalized benzoxazine (NI-BOZ) via Mannich reaction. A novel thermosetting resin was obtained from high temperature curing of NI-BOZ. Structure of NI and NI-BOZ were characterized by FTIR, 1H NMR and 13C NMR. Curing kinetics of NI-BOZ was monitored by DSC and thermal properties of poly(NI-BOZ) were evaluated by DMA and TGA. The results showed that the activation energy of NI-BOZ thermal curing was 86.27 kJ·mol-1 and the reaction order was 0.91. Poly(NI-BOZ) had glass transition temperature (Tg) of 215℃ in air environment. The polymer had 5% mass loss at 445℃, 10% mass loss at 467℃ and 63% char yield at 800℃ under nitrogen.
Keywords:norbornene-imide  benzoxazine  synthesis  NMR  thermal performance  thermosetting resin  
点击此处可从《化工学报》浏览原始摘要信息
点击此处可从《化工学报》下载全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司    京ICP备09084417号-23

京公网安备 11010802026262号