| 电子封装陶瓷基片材料研究现状 |
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| 引用本文： | 郝洪顺,付鹏,巩丽,王树海.电子封装陶瓷基片材料研究现状[J].陶瓷(咸阳),2007(5):24-27. |
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| 作者姓名： | 郝洪顺 付鹏 巩丽 王树海 |
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| 作者单位： | 1. 山东理工大学材料学院,山东,淄博,255049
2. 聊城大学材料学院,山东,聊城,252059 |
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| 摘 要： | 阐述了电子封装领域对基片材料的基本要求，分析了几种常用的陶瓷基片材料的性能特点，论述了电子封装陶瓷基片材料的研究现状，并指出了发展方向。
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| 关 键 词： | 电子封装 陶瓷基片 性能 研究现状 |
Recent Achievement in Research for Electronic Packaging Ceramic Substrate Materials |
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| Hao Hongshun,Fu Peng,Gong Li,Wang Shuhai.Recent Achievement in Research for Electronic Packaging Ceramic Substrate Materials[J].Ceramics,2007(5):24-27. |
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| Authors: | Hao Hongshun Fu Peng Gong Li Wang Shuhai |
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| Affiliation: | 1 School of Materials Science and Engineering, Shandong University of Technology, Shandong, Zibo, 255049;2 Material Institute of Liaocheng University, Shandong, Liaocheng, 252059 |
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| Abstract: | Reviews the elemental requirements for electronic packaging substrate materials, and analyses the characteristics of some common ceramics substrate used for electronic packaging, and discusses the rencent achievements in the research for electronic packaging ce- ramic substrate materials. |
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| Keywords: | Electronic packaging Ceramic substrate Performance Present research |
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