生物基底材料上纳米金薄膜导电、传热性能研究

利用瞬态电热技术测量了不同生物基底材料的热扩散率。通过增加镀层数目,采用微分测量法进行实验,根据实验结果计算了相应基底材料上厚度为5.00～20.00nm金薄膜的洛伦兹数、导热系数以及导电系数。研究结果表明,由于晶格边界散射大大减小了薄膜的导电和导热系数,所有基底上金薄膜的导热和导电系数均小于体材料金的导热和导电系数。由于蚕丝中的蛋白晶体可促进电子跳跃并产生隧道效应,蚕丝基底上金薄膜的导电系数大于其他几种基底上金薄膜的导电系数,因此蚕丝更适合作为柔性电子器件中的基底材料。

Thermal and electrical properties of nano gold films coated on biological substrates

In this work, the thermal diffusivities of thin gold films coated on different substrate materials are measured by the transient electro-thermal (TET) technique. By increasing the number of the coating, the differential measurement method was used to carry out the experiment. According to the experimental results, the Lorenz number, thermal and electrical conductivities of the gold film with 5-20 nm thickness on the base material were calculated. The results show that the thermal and electrical conductivities of the thin film are greatly reduced by the scattering of the lattice boundary due to the small thickness of the film. The thermal and electrical conductivities of the gold film on all the substrates are less than those of the bulk material. Because of the protein crystals in silkworm silk can make electron hopping and tunneling, the electrical conductivity of gold films on silkworm silk substrate larger than on other types of substrates. As the thermal conductivity of silkworm silk itself is small, the silkworm silk is more suitable as a substrate material of flexible electronic device.