| 积层板的制造方法 |
| |
| 引用本文： | 蔡积庆. 积层板的制造方法[J]. 印制电路信息, 2006, 0(12): 45-51 |
| |
| 作者姓名： | 蔡积庆 |
| |
| 摘 要： | 概述了积层板的开发背景、制造工艺和最近的开发动向。
|
| 关 键 词： | 积层多层板 电性能 制造工艺 可靠性 |
Manufacturing Methods of Build-up PCB |
| |
| Cai Jiqing. Manufacturing Methods of Build-up PCB[J]. Printed Circuit Information, 2006, 0(12): 45-51 |
| |
| Authors: | Cai Jiqing |
| |
| Abstract: | This paper describes the development background, manufacturing process and newly developmenttrend of build-up PCB. |
| |
| Keywords: | build-up multilayer board electronic property manufacturing process reliability |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
