碳酸钙粉体无钯活化化学镀银研究

采用无钯活化粉体化学镀技术制备了银包碳酸钙导电粉体.探讨了表面处理和PH值对沉积效果的影响,以及复合粒子的结合强度.通过扫描电镜(SEM),X射线能量色散谱仪(EDS)和X射线衍射(XRD)对复合粉体进行表面形貌分析和成分测试.结果表明:碳酸钙粉体经WD-50表面处理后,生成的银粒子粒径较小,对碳酸钙粒子的包覆均匀致密.随着镀液pH值的升高,银的析出量增大,粉体表观颜色变浅.调节镀液pH至13.0,得到了镀层结合强度高的银包碳酸钙复合粉体.

A Study of Electroless Silver Plating Activted without Palladium on the Surface of CaCO3 Particles

Electroless silver plating on the surface of CaCO3 particles was obtained through Pd-free activation process and electroless plating on particles technology.The effects of the surface treatment and PH value on the deposition process were studied.The bonding strength of the composite particles were investigated.The morphologies of the particles were studied with scanning electron microscopy（SEM） and their chemical composition were confirmed by Energy dispersive spectroscopy（EDS） and X-ray diffraction（XRD）.The results reveals that,WD-50 treated CaCO3 particles were uniformly coated by silver particles and the silver particles size were smaller compared with untreated CaCO3 particles.Precipitation quantity of silver increased with PH value increasing while the powder color was lighter.Thus,homogenous and dense silver coating CaCO3 composite particles with high bonding strength were synthesised when the value of pH is about 13.