| 铜电化学沉积在微孔金属化中的应用 |
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| 引用本文： | 杨防祖,吴伟刚,田中群,周绍民.铜电化学沉积在微孔金属化中的应用[J].物理化学学报,2011,27(9):2135-2140. |
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| 作者姓名： | 杨防祖 吴伟刚 田中群 周绍民 |
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| 作者单位： | College of Chemistry and Chemical Engineering, State Key Laboratory of Physical Chemistry of the Solid Surfaces, Xiamen University, Xiamen 361005, Fujian Province, P. R. China |
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| 基金项目： | 国家自然科学基金，国家重点基础研究发展规划项目(973) |
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| 摘 要： | 以分布有微孔的印刷线路板(PCB)作为模板,按照PCB孔金属化工艺路线,研究乙醛酸化学镀铜和柠檬酸盐体系铜电沉积工艺在PCB微孔金属化中的应用.结果表明,乙醛酸化学镀铜和柠檬酸盐体系电沉积铜可以成功地应用于PCB微孔金属化加工工艺中.微孔化学镀铜金属化导电处理后,铜附着于微孔内壁,颗粒细小,但排列疏松且局部区域发生漏镀现象.微孔一经电镀铜加厚,镀层电阻显著下降;孔壁内外的铜沉积速率达到0.8:1.0;铜颗粒具有一定的侧向生长能力,能够完全覆盖化学镀铜时产生的微小漏镀区域;微孔内壁铜镀层连续、结构致密并紧密附着于内壁,大大增强了PCB上下层互连的导电性能.
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| 关 键 词： | 微孔 化学镀铜 电沉积铜 金属化 印刷线路板 |
| 收稿时间： | 2011-05-27 |
| 修稿时间： | 2011-08-01 |
Application of Copper Electrochemical Deposition for the Metallization of Micropores |
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| YANG Fang-Zu,WU Wei-Gang,TIAN Zhong-Qun,ZHOU Shao-Min.Application of Copper Electrochemical Deposition for the Metallization of Micropores[J].Acta Physico-Chimica Sinica,2011,27(9):2135-2140. |
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| Authors: | YANG Fang-Zu WU Wei-Gang TIAN Zhong-Qun ZHOU Shao-Min |
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| Affiliation: | College of Chemistry and Chemical Engineering, State Key Laboratory of Physical Chemistry of the Solid Surfaces, Xiamen University, Xiamen 361005, Fujian Province, P. R. China |
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| Abstract: | According to established routes for the microporous metallization of printed circuit boards(PCB),electroless copper plating using glyoxylic acid as a reducing agent and copper electroplating in a citrate bath were used for microporous metallization with PCB distributing micropores as a template.The results show that electroless copper plating using glyoxylic acid as a reducing agent and copper electroplating in a citrate bath can be successfully applied to the microporous metallization of PCB.After an elect... |
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| Keywords: | Micropore Electroless copper plating Copper electroplating Metallization Printed circuit board |
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