| 无铅焊膏的设计与展望 |
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| 引用本文： | 史耀武,雷永平,夏志东,郭福,李晓延.无铅焊膏的设计与展望[J].电子元件与材料,2008,27(9). |
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| 作者姓名： | 史耀武 雷永平 夏志东 郭福 李晓延 |
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| 作者单位： | 北京工业大学,材料学院,北京,100022 |
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| 基金项目： | 国家科技支撑重点项目，北京市属市管高校人才强教计划 |
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| 摘 要： | 分析了无铅焊膏的构成和技术要求。对无铅焊膏用焊粉及助焊剂配方设计的现状进行了讨论,焊粉的成分多为Sn、Ag和Cu,粒度越来越多地采用20μm;助焊剂多为改性松香、有机酸活化剂等。展望了无铅焊膏的研究与发展趋势。
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| 关 键 词： | 电子技术 无铅焊膏 综述 配方设计 |
Design and prospect of lead-free solder paste |
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| SHI Yao-wu,LEI Yong-ping,XIA Zhi-dong,GUO Fu,LI Xiao-yan.Design and prospect of lead-free solder paste[J].Electronic Components & Materials,2008,27(9). |
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| Authors: | SHI Yao-wu LEI Yong-ping XIA Zhi-dong GUO Fu LI Xiao-yan |
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| Affiliation: | SHI Yao-wu,LEI Yong-ping,XIA Zhi-dong,GUO Fu,LI Xiao-yan (School of Materials Science , Engineering,Beijing University of Technology,Beijing 100022,China) |
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| Abstract: | Constituents and technical requirements of lead-free solder paste were analyzed. Current state of the formulation design of solder powder and fluxes used for lead-free solder paste was discussed. Ingredients of solder powder are Sn、Ag and Cu, generally, particle size of 20 μm is used more and more, ingredients of fluxes include modified rosin、organic acid activators etc. The prospect for the research and development tendency of lead-free solder paste was made. |
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| Keywords: | electron technology lead-free solder paste review formulation design |
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