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Full wafer microlens replication by UV imprint lithography
Authors:H Schmitt  M Rommel  AJ Bauer  L Frey  A Bich  M Eisner  R Voelkel  M Hornung
Affiliation:1. Fraunhofer Institute for Integrated Systems and Device Technology (IISB), Schottkystrasse 10, D-91058 Erlangen, Germany;2. Erlangen Graduate School in Advanced Optical Technologies (SAOT) and Chair of Electron Devices (LEB), Friedrich-Alexander-University Erlangen-Nuremberg, Cauerstrasse 6, D-91058 Erlangen, Germany;3. SUSS MicroOptics SA, Rue Jaquet-Droz 7, CH-2000 Neuchatel, Switzerland;4. SUSS MicroTec Lithography GmbH, Schleissheimer Str. 90, D-85748 Garching, Germany;1. Department of Optoelectronics Science, Harbin Institute of Technology, Weihai, China;2. School of Computer and Information, Hefei University of Technology, Hefei, China;3. School of Energy Science and Engineering, Harbin Institute of Technology, Harbin, China;4. College of Power and Energy Engineering, Harbin Engineering University, Harbin, China;1. CEA–LETI-Minatec, 17 rue des Martyrs, 38054 Grenoble, France;2. Tecnalia, Division Industria y Transporte, Parque Tecnológico, E-20009 Donostia-San Sebastián;1. State Key Laboratory for Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, China;2. Key Laboratory of Photonics Technology for Information, Xi’an Jiaotong University, Xi’an 710049, China;3. Key Laboratory of Advanced Display and System Applications, Shanghai University, Ministry of Education, China;1. Department of Energy Science, Sungkyunkwan University, Suwon 440-746, Republic of Korea;2. College of Information and Communication Engineering, Sungkyunkwan University, Suwon 440-746, Republic of Korea;3. Department of Physics, COMSATS Institute of Information Technology, Lahore 54000, Pakistan
Abstract:The fabrication of microlenses is of great interest for several applications in the field of optics like wafer level cameras, homogenization of light, and coupling of light into glass fibers. Especially for low-cost optical products, microlenses have to be fabricated with a high throughput at an adequate quality. One way to fulfil these requirements is the patterning of microlenses by UV imprint lithography (UV-IL). Within this work, microlenses were replicated into the UV curing material PAK-01 by step and stamp UV-IL on silicon substrates with a diameter of 150 mm. The resulting substrates were used as masters to cast PDMS templates. These PDMS templates can be used for high throughput full wafer UV-IL. Additionally, quartz substrates with a diameter of 100 mm were patterned which could be directly used as so called “optowafers”. Master and patterned microlenses were inspected by scanning electron microscopy and with a white light profilometer. The results clearly demonstrate the excellent quality of the replication process and the capability of UV-IL to pattern microlenses on full wafer level for high throughput applications.
Keywords:
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