用硼钨杂多配合物的稀土多元扩渗法制备共生型钨青铜及其电性能的研究．

采用稀土多元扩渗的方法，通过高温热解硼钨杂多配合物制备了共生型（ITB）钨青铜。对产物结构进行了XRD、XPS、TG—DTA表征，同时研究了温度对共生型钨青铜的导电性能的影响。结果表明，共生型钨青铜电导率随温度变化呈现一定规律：从室温（300K左右）到500K左右，电导率随温度变化不大，从525K开始电导率有个突增阶段，在600～625K左右达到最大值。在前躯体是硼钨钆的情况下，混合稀土扩渗得到的钨青铜室温电导率为1．05×10^-2S·cm^-1，产物在500％以下具有较好的热稳定性。

Study on Preparation of Intergrowth Tungsten Bronze by Permeation with Boron Tungsten Heteropoly Compounds and Its Electrical Property

The compositions of product were confirmed by XRD, XPS and TG - DTA, and the effect of temperature on the electrical conductivity of intergrowth tungsten bronze （ITB） was also studied. The results indicate that the electrical conductivity of ITB shows a certain rule with temperature ： from room temperature （ about 300K） to about 500K the electrical conductivity changes little, from 525 K it increases suddenly, at about 600 - 625 K it reaches maximum. With using boron - tungsten - gadolinium as precursor, the tungsten bronze prepared by mixed rare earth permeation has a good thermal stability under 500℃, and its electrical conductivity is 1.05×10^-2S·cm^-1 at room temperature.