| 准分子激光微制造技术及其应用 |
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| 引用本文： | 陈志凌,史铁林,刘胜,熊良才. 准分子激光微制造技术及其应用[J]. 激光与光电子学进展, 2004, 41(2): 47-53 |
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| 作者姓名： | 陈志凌 史铁林 刘胜 熊良才 |
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| 作者单位： | 华中科技大学微系统研究中心,武汉,430074;华中科技大学微系统研究中心,武汉,430074;华中科技大学微系统研究中心,武汉,430074;华中科技大学微系统研究中心,武汉,430074 |
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| 基金项目： | 863计划资助，项目编号为:2002AA421190 |
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| 摘 要： | 比较分析四种微加工工艺的基本特征和技术难点，简述准分子激光与Nd：YAG激光微制造技术的特点和应用范围。结合华中科技大学准分子激光微制造工作站的建设及其在微钻孔、微切割等方面的实际应用，分析准分子激光在MEMS(微机电系统)键合、焊接、封装过程中应用的可能性。
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| 关 键 词： | 准分子激光 微制造 MEMS封装 |
| 收稿时间： | 2003-09-04 |
Excimer Laser Based Micro-Manufacturing Technology and Its Application |
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| CHEN Zhiling SHI Tielin LIU Sheng XIONG Liangcai. Excimer Laser Based Micro-Manufacturing Technology and Its Application[J]. Laser & Optoelectronics Progress, 2004, 41(2): 47-53 |
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| Authors: | CHEN Zhiling SHI Tielin LIU Sheng XIONG Liangcai |
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| Abstract: | A comparison was given of properties of four micro-machining processes. Excimer laser)and Nd∶YAG laser based micro-machining were described. An excimer laser based micro-machining workstation in Huazhong University of Science and Technology was installed, which was used in micro-drilling and micro-cutting.. The workstation will be modified for cutting, die bonding, wire bonding, welding, and post-packaging in MEMS. |
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| Keywords: | excimer laser manufacturing MEMS packaging |
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