| 倒装焊器件尺寸参数对低k层及焊点的影响 |
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| 引用本文： | 赵明君. 倒装焊器件尺寸参数对低k层及焊点的影响[J]. 电子工业专用设备, 2009, 38(11): 6-9 |
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| 作者姓名： | 赵明君 |
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| 作者单位： | 桂林电子科技大学机电工程学院,广西,桂林,541004 |
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| 摘 要： | 当前。集成电路制造中低k介质与铜互连集成工艺的引入已经成为一种趋势，因此分析封装器件中低矗结构的可靠性是很有必要的。利用有限元软件分析了倒装焊器件的尺寸参数对低k层及焊点的影响。结果表明：减薄芯片，减小PI层厚度，增加焊点高度，增加焊盘高度，减小基板厚度能够缓解低k层上的最大等效应力；而减薄芯片，增加PI层厚度，增加焊点高度，减小焊盘高度，减小基板厚度能够降低焊点的等效塑性应变。
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| 关 键 词： | 电子技术 低k倒装焊器件 有限元 |
Effects of the Size Parameters of Flip-chip Device on Low-K Layer and Solder Joints Reliability |
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| ZHAO Mingiun. Effects of the Size Parameters of Flip-chip Device on Low-K Layer and Solder Joints Reliability[J]. Equipment for Electronic Products Marufacturing, 2009, 38(11): 6-9 |
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| Authors: | ZHAO Mingiun |
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| Affiliation: | ZHAO Mingjun(School of Mechanical & Electrical Engineering,Guilin University of Electronic Technology,Guilin 541004,China) |
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| Abstract: | At present, it has become a trend that low-k dielectric and copper interconnect integration process is introduced in IC manufacturing, so the reliability analysis of the low-k structures in package device is necessary.In this paper, the effects of the size parameters of the flip-chip device on low-k layer and solder joints reliability were investigated by finite element software.The results showed that:thinner die, thinner the PI layer, taller solder joint height, taller Cu pad height, thinner substrate can... |
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| Keywords: | Electron technology Low-K flip chip device FEM |
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