基于中心积分法的11维集成光波导芯片封装系统

研制了基于中心积分法的集成光波导芯片封装系统,该系统在空间11维上实现了光波导器件的位置调节,通过高精度对准和改进后的中心积分法快速准确地实现芯片对准。在单芯光纤-条波导-单芯光纤系统的封装测试实验中,端面耦合损耗的平均值为0.113 6 dB,单次耦合损耗的最大值＜0.13 dB,标准偏差＜0.02 dB,单次耦合时间＜2 min。在单芯光纤列阵-1×8波导分支耦合器-8芯光纤列阵的封装生产中,各通道插入损耗均＜10.5 dB,均匀性指标＜0.4 dB,单次耦合时间＜5 min。数据证明,该系统已完全达到商业化标准,具有良好效果和实用性。

11D integrated optic waveguide chip packaging system based on center-integration algorithm

A 11D integrated optic waveguide chip packaging system based on center-integration algorithm was designed and fabricated for adjusting the 11D positions of a waveguide in the space. The chip alignment can be realized quickly and precisely by the precision alignment and the improved center-integration algorithm. The packaging test among single-core fiber, channel waveguide and single-core fiber shows that the average of end-coupling loss is 0.113 6 dB, the maximum of single coupling loss is less than 0.13 dB, the standard deviation less than 0.02 dB, single coupling time less than 2 min and the whole packaging process time less than 5 min. The packaging produce among single-core fiber array, 1×8 splitter coupler and 8-core fiber array shows that insert loss of every channel is less than 10.5 dB,the homogeneity index less than 0.4 dB, the single coupling time less than 5 min and the whole packaging process time less than 7 min. It is validated that the system can reach the commercial standard by the test data, which means that the system has good effect and practicability.