Monolayer deposition of silver and copper onto platinum electrodes at non-equilibrium conditions

Ag and Cu were deposited in submonolayer amounts onto Pt electrodes at constant cathodic potentials within the hydrogen adsorption region. Rectangular pulses of Cu²⁺ or Ag⁺ fluxes to the Pt surface were generated by a Cu or Ag generator electrode using the twin electrode thin-layer technique. The analysis of the response currents of the Pt electrode yields in formation about the metal deposition process at non-equilibrium conditions. Cu and Ag were found to deposit directly as monolayers and not at random. The displacement of adsorbed hydrogen was measured as a function of the quantity of metal deposited.