Cu（Al）／SiO2复合薄膜及显微特征

采用真空离子镀膜机在SiO2玻璃基片表面分别蒸镀Cu和Al薄膜，3组参数6次制备12个铝或铜薄膜试样．实验表明：相同工艺条件下，铝膜较铜膜附着力更强，膜厚更大，更易形成薄膜且结构均匀致密．经测试可知：当铝膜的轰击电压为175V，烘烤电压为160V，蒸镀时间为2h、铜膜的轰击电压为200V，烘烤电压为100V，蒸镀时间为1．8h，制得的样品纯度高，杂质含量少，微观结构与膜厚最理想，界面结构规范，平滑，吸附力强，薄膜界面微观粗糙性和形状较佳．

CU(Al)/SiO2 Laminated Film and Micro-characteristic

Cu and the Al films were spread separately in the surface of SiO2 glass substrate by vacuum evaporation machine. In this paper, 24 aluminum or copper film samples with three parameters were prepared by six times. The result indicates that under the same technique condition, the thicker aluminium films have larger adherence than the copper ones and are much easier to form films whose structure is uniform. Analysis by XPS shows ： NO. 2, 9,11 aluminium film samples and NO. 6,7 copper ones are better that others in purity and have less impurity. Analysis by SEM shows thickness and boundary features, NO. 2,9,11 aluminium films samples and NO. 5,7 copper ones have best apparent structure; NO. 1,2 aluminium film samples and NO. 6,7 copper ones have the best microscopic structure and thickness. Analysis of coating quality indicates that the greater the roasting voltage, the stronger the bombardment voltage and the higher the pressure coating, the more excellent their quality.