| 用有限差分法实现集成电路的电热耦合模拟 |
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| 引用本文： | 王乃龙,刘淼,周润德.用有限差分法实现集成电路的电热耦合模拟[J].微电子学,2004,34(3):295-297,301. |
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| 作者姓名： | 王乃龙 刘淼 周润德 |
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| 作者单位： | 清华大学,微电子学研究所,北京,100084 |
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| 基金项目： | 国家自然科学基金资助项目(59995550-01) |
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| 摘 要： | 文章详细介绍了一种用于集成电路自热效应研究的电热耦合模拟软件(ETsira2)。针对具体的集成电路封装结构以及特定的封装材料，该软件利用有限差分数值算法(FDM)，求解三维热扩散方程；对集成电路芯片进行了精确的三维热学分析和电学性能验证。
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| 关 键 词： | CMOS集成电路 电热耦合效应 有限差分法 |
| 文章编号： | 1004-3365(2004)03-0295-03 |
Electro-Thermal Simulation of Integrated Circuits Using Finite Difference Method |
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| WANG Nai-long,LIU Miao,ZHOU Run-de.Electro-Thermal Simulation of Integrated Circuits Using Finite Difference Method[J].Microelectronics,2004,34(3):295-297,301. |
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| Authors: | WANG Nai-long LIU Miao ZHOU Run-de |
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| Abstract: | A new electro-thermal simulator (ETsim2) for self-heat effect of integrated circuits is presented. For specific IC packages and special packaging materials, the simulator solves 3-D thermal diffusion equation by using the finite difference method (FDM). Substrate thermal distribution of IC chips is accurately estimated and their electrical performances are validated using this model. |
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| Keywords: | CMOS IC Electro-thermal coupling effect Finite difference method |
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