| 向后兼容混合焊点的可靠性分析 |
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| 引用本文： | 徐龙会,蒋廷彪.向后兼容混合焊点的可靠性分析[J].电子工艺技术,2006,27(5):272-276. |
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| 作者姓名： | 徐龙会 蒋廷彪 |
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| 作者单位： | 桂林电子科技大学,广西,桂林,541004 |
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| 摘 要： | 在从有铅向无铅转换过程中,电子产品制造商不可避免会碰到同一组装过程中有铅和无铅的混合情况.因此,有必要对形成的混合焊点进行可靠性分析.对混合焊点的失效形式和混合焊点的失效机理进行了分析,并进一步介绍了影响这类焊点可靠性的因素.
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| 关 键 词： | 混合焊点 向后兼容焊点 可靠性 失效 |
| 文章编号： | 1001-3474（2006）05-0272-05 |
| 收稿时间： | 2006-07-17 |
| 修稿时间： | 2006年7月17日 |
Reliability Analysis of Backwards Compatible Mixed Solder Joint |
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| XU Long-hui,JIANG Ting-biao.Reliability Analysis of Backwards Compatible Mixed Solder Joint[J].Electronics Process Technology,2006,27(5):272-276. |
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| Authors: | XU Long-hui JIANG Ting-biao |
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| Affiliation: | Guilin University of Electronic Technology, Guilin 541004, China |
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| Abstract: | In the transition to lead-free from lead,there is expected to be a period when lead and lead-free materials will be used within the same mounting process for the manufacturers of electronic products.Therefore,it is necessary to study the reliability of this mixed solder joint.Analyse the failure modes and mechanism of the mixed solder joint,and introduce the effect factors of reliability ulteriorly. |
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| Keywords: | Mixed solder joint Backwards compatible solder joint Reliability Failure |
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