| 端子模跳屑原因分析及解决措施 |
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| 引用本文： | 欧阳波仪.端子模跳屑原因分析及解决措施[J].模具制造,2005(11):26-28. |
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| 作者姓名： | 欧阳波仪 |
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| 作者单位： | 株洲职业技术学院,湖南,株洲,412002 |
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| 摘 要： | 分析了端子模跳屑产生的不同原因，归纳总结了各种解决措施的优缺点，以及各自的应用场合。对端子模设计、制造有较强的指导意义。
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| 关 键 词： | 跳屑 受力分析 产生原因 解决措施 原因分析 子模 归纳总结 |
Reason Analysis and Solving Method to Outside Chip of Terminal Die |
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| OuYang Boyi.Reason Analysis and Solving Method to Outside Chip of Terminal Die[J].Die & Mould Manufacture,2005(11):26-28. |
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| Authors: | OuYang Boyi |
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| Abstract: | Different reasons caused outside chip o and disadvantages summarized, which of various solving can be a guidance steps and its f terminal die are analyzed, the advantages applicable circumstance are classified and to terminal die design and manufacture. |
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| Keywords: | outside chip load analysis caused reason solving method |
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