| 毫米波射频互连微组装工艺优化研究 |
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| 引用本文： | 任榕,卢绍英,赵丹,解启林,邱颖霞.毫米波射频互连微组装工艺优化研究[J].电子与封装,2013(10):1-4,9. |
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| 作者姓名： | 任榕 卢绍英 赵丹 解启林 邱颖霞 |
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| 作者单位： | 中国电子科技集团公司第38研究所,合肥,230088 |
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| 摘 要： | 在毫米波产品的装配中,射频互连微组装工艺是影响产品性能的一个重要因素。采用三维电磁仿真软件对毫米波频段的组装缝隙宽度、金丝热超声楔焊跨距及拱高进行了建模仿真,分析了上述因素对驻波的影响。针对模拟仿真优化结果,给出了毫米波射频互连装配精度控制、接地焊接效果优化、金丝热超声楔焊线型及键合参数优化等相应的工艺优化措施,从而达到毫米波射频互连微组装工艺优化的目的。
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| 关 键 词： | 毫米波射频互连 微组装工艺优化 装配精度 接地效果 金丝热超声楔焊 |
Process Optimization for Technology of Micro Assembly in Millimeter Wave RF Interconnection |
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| REN Rong
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LU Shaoying
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ZHAO Dan
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XIE Qilin
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QIU Yingxia.Process Optimization for Technology of Micro Assembly in Millimeter Wave RF Interconnection[J].Electronics & Packaging,2013(10):1-4,9. |
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| Authors: | REN Rong LU Shaoying ZHAO Dan XIE Qilin QIU Yingxia |
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| Affiliation: | (China Electronics Technology Group Corporation No.38 Research Institute, Hefei 230088, China) |
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| Abstract: | Micro assembly of RF interconnection is the key means in the assembly of millimeter wave products. The three-dimensional electromagnetic simulation software was used to simulate analysis of millimeter wave RF interconnection models. The impacts of assembly slit width and gold wire thermo-sonic wedge bonding on the voltage standing wave ratio were analyzed. Based on the simulation results, optimum processes such as assembly precision control, grounding connection effect, bond-wire loop parameter and bond parameter optimization were provided. And then the optimum performance was obtained for micro assembly of millimeter wave RF interconnection process. |
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| Keywords: | millimeter wave RF interconnection process optimization of micro assembly technology assembly precision grounding connection effect gold wire thermo-sonic wedge bonding |
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