小直径砂轮超声振动磨削SiC陶瓷的表面质量研究

用小直径砂轮超声振动磨削和普通磨削加工SiC陶瓷零件，对比研究砂轮线速度、工件进给速度、磨削深度和超声振幅对其磨削表面质量的影响。结果表明:与普通磨削相比，超声振动磨削的磨粒轨迹相互交叉叠加，工件表面形貌更均匀，表面质量更好。由于超声振动时的磨粒划痕交叉会使磨粒产生空切削，因而降低了其磨削力，使磨削过程更加稳定。超声振动磨削的表面粗糙度和磨削力随砂轮线速度和超声振幅的增加而降低，随工件进给速度和磨削深度的减小而降低。且砂轮线速度、工件进给速度较小时，超声振动磨削的效果更明显。 

Study on surface quality in ultrasonic vibration grinding of SiC ceramics with small diameter grinding wheel

The SiC ceramic parts were machined by ultrasonic vibration grinding and common grinding with small diameter grinding wheel.The effects of grinding wheel linear speed,workpiece feed speed,grinding depth and ultrasonic amplitude on ground surface quality were studied.The results show that compared with the conventional grinding,the grinding tracks of ultrasonic vibration grinding are overlapped with each other,with more uniform surface morphology of workpiece and better surface quality.Because of the scratch crossing of the abrasive grains in ultrasonic vibration,the abrasive grains will produce empty cutting,thus reducing the grinding force and making the grinding process more stable.The surface roughness and the grinding force of ultrasonic vibration grinding decrease with the increase of grinding wheel linear speed and ultrasonic amplitude and the decrease of workpiece feed speed and grinding depth.When the linear speed of grinding wheel and the feed speed of workpiece are low,the effect of ultrasonic vibration grinding is more obvious.