| 电路板化学镀金液IG-600的研制 |
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| 引用本文： | 高敏,陆云. 电路板化学镀金液IG-600的研制[J]. 广东化工, 2009, 36(7): 21-22,65 |
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| 作者姓名： | 高敏 陆云 |
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| 作者单位： | 广东省石油化工研究院,广东省化学工业公共实验室,广东,广州,510665 |
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| 摘 要： | 文章介绍一种用于电路板化学镀镍／沉金工艺的置换型化学镀金液IG-600。这种处理液通过加入特殊的复合缓蚀剂，减轻镀液对镍层的过度腐蚀，有效蒴止“黑色镍垫”的发生，提高化学镀镍／沉金处理的良晶率。
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| 关 键 词： | 化学镀镍 化学镀金 缓蚀剂 黑色镍垫 |
Development of Electroless Gold Plating Bath IG-600 for PCBs |
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| Gao Min,Lu Yun. Development of Electroless Gold Plating Bath IG-600 for PCBs[J]. Guangdong Chemical Industry, 2009, 36(7): 21-22,65 |
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| Authors: | Gao Min Lu Yun |
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| Affiliation: | Gao Min,Lu Yun (Guangdong Open Laboratory of Chemical Engineering,Guangdong Research Institute of Petrochemical Industry,Guangzhou 510665,China) |
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| Abstract: | The paper introduced a displacement electroless gold plating solution IG-600 for electroless nickel/immersion gold(ENIG) process in printed circuit boards. This solution contains tow special inhibitors which can effectively eliminate nickel corrosion by electroless gold solution. IG-600 can deposit excellent gold on nickel layer without black pad problem and improve ENIG process yields. |
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| Keywords: | electroless nickel electroless gold inhibitor black pad |
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