| 铜粉调节酸性镀铜溶液氯离子浓度研究 |
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| 引用本文： | 郭远凯,唐春保.铜粉调节酸性镀铜溶液氯离子浓度研究[J].广东化工,2012(4):85-86. |
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| 作者姓名： | 郭远凯 唐春保 |
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| 作者单位： | 嘉应学院化学与环境学院,广东梅州514015 |
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| 摘 要： | 酸性光亮镀铜工艺中氯离子的含量直接影响镀层的光亮度,控制镀铜液中氯离子含量对酸性光亮镀铜工艺具有重要的实际意义。本实验采用实际镀铜液,考察了比浊法测定氯离子条件,以及温度、反应实验、铜粉加入量对氯离子的去除效果。实验结果表明:氯离子的最佳去除条件为反应温度为50℃,反应时间10 min,铜粉用量为0.4 g时,对氯离子去除率为55.52%,控制镀铜液中氯离子浓度50 mg/L左右。
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| 关 键 词： | 比浊法 镀铜 酸性 氯离子 |
The Removal of Chloridion by Copper Powder Processing Method in Acid Coppering Gloss Agent |
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| Guo Yuankai,Tang Chunbao.The Removal of Chloridion by Copper Powder Processing Method in Acid Coppering Gloss Agent[J].Guangdong Chemical Industry,2012(4):85-86. |
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| Authors: | Guo Yuankai Tang Chunbao |
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| Affiliation: | (School of Chemistry and Environmental Jiaying University,Meizhou 514015,China) |
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| Abstract: | The concentration of chloride has a direct influence on the radiance in the copper planting technology.Adjusting the concentration of chloride has an important application.In the paper,the determination condition of turbidimetry and the effect of removal chloride by temperature,time and amount of copper power are investigated.The result shows that the best removal rate of chloride is that the rate reach 55.52 % after added the 0.4 g of copper powder,at 50 ℃ and the reaction time was 10 min. |
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| Keywords: | nephelometry copper plating acidic chloride ion |
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