| 镀银铜粉导电胶的研究 |
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| 引用本文： | 吴懿平,吴大海,袁忠发,吴丰顺,安兵.镀银铜粉导电胶的研究[J].电子元件与材料,2005,24(4):32-35. |
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| 作者姓名： | 吴懿平 吴大海 袁忠发 吴丰顺 安兵 |
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| 作者单位： | 华中科技大学微系统中心,湖北,武汉,430074;华中科技大学塑性成型模拟及模具技术国家重点实验室,湖北,武汉,430074;华中科技大学微系统中心,湖北,武汉,430074 |
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| 摘 要： | 经过对200目商用铜粉进行球磨处理得到2~8μm细片状铜粉,再进行多次化学镀银处理,得到表面银覆盖率达90%以上的一种高性能镀银铜粉。该镀银铜粉与环氧树脂、固化剂以及其它添加剂合成制得的镀银铜粉导电胶,防铜氧化效果好,电阻稳定且电阻率可达10–4Ω·cm级别,相比银导电胶成本降低,耐迁移效果好。
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| 关 键 词： | 电子技术 镀银铜粉 导电胶 热重法 电迁移 |
| 文章编号： | 1001-2028(2005)04-0032-04 |
Research of Silver Plating Copper Filled Conductive Adhesive |
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| WU Yi-ping,WU Da-hai,YUAN Zhong-fa,WU Feng-shun,AN Bing.Research of Silver Plating Copper Filled Conductive Adhesive[J].Electronic Components & Materials,2005,24(4):32-35. |
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| Authors: | WU Yi-ping WU Da-hai YUAN Zhong-fa WU Feng-shun AN Bing |
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| Affiliation: | WU Yi-ping1,2,WU Da-hai1,YUAN Zhong-fa1,WU Feng-shun1,2,AN Bing1,2 |
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| Abstract: | A micro-flake 2~8 μm copper powder was obtained by grinding commercial copper powder. With several electroless plating silver treatments to the micro-flake copper powder, a high performance copper powder covered with more than 90% surface with silver was obtained. A kind of conductive adhesive consists of above copper powder, epoxy resin, harder and other additives was synthesized, which can prevent copper powder’s oxidation effectively. In addition, it has a stable resistance and low resistivity. Compared with silver conductive adhesive, it has lower cost and better to bear electronmigration. |
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| Keywords: | electronic technology silver plating copper powder isotropic conductive adhesive TGA electronmigration |
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