| 随机工艺变化下互连线ABCD参数建模与仿真 |
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| 引用本文： | 张瑛,;王志功,;方承志,;杨恒新.随机工艺变化下互连线ABCD参数建模与仿真[J].南京邮电学院学报(自然科学版),2009(6):85-90. |
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| 作者姓名： | 张瑛 ;王志功 ;方承志 ;杨恒新 |
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| 作者单位： | [1]南京邮电大学电子科学与工程学院,江苏南京210046; [2]东南大学射频与光电集成电路研究所,江苏南京210096 |
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| 基金项目： | 基金项目：南京邮电大学引进人才基金（NY207025）资助项目 |
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| 摘 要： | 集成电路的不断发展使得互连线的随机工艺变化问题已经成为影响集成电路设计与制造的重要因素。基于电报方程建立了工艺变化下互连线的分布参数随机模型,推导出互连线ABCD参数满足的随机微分方程组,并提出了基于蒙特卡洛法的互连线ABCD参数统计分析方法,通过对ABCD参数各参量系数的正态性进行偏度-峰度检验,给出了最差情况估计。实验结果表明所提出的互连线随机模型及统计分析方法可以对工艺变化下的互连线传输性能进行有效的评估。
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| 关 键 词： | 互连线 电报方程 随机建模 随机微分方程 蒙特卡洛法 |
Modeling and Simulating the ABCD Parameters of Interconnects in the Presence of Random Process Variations |
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| Affiliation: | ZHANG Ying1,2,WANG Zhi-gong2,FANG Cheng-zhi1,YANG Heng-xin1(1.College of Electronics Science and Engineering,Nanjing University of Posts and Telecommunications,Nanjing 210046,China2.Institute of RF＆OE-ICs,Southeast University,Nanjing,210096,China ) |
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| Abstract: | With the great development of Integrated Circuits（IC）,random process variations of interconnects has been an important factor which impacts the IC design and manufacture.On the basis of telegraph equation,the stochastic interconnect model with distributed parameters is proposed in the presence of process variations.The stothastic differential equation of the ABCD parameters is derived,and Monte Carlo method based statistical analysis method for the ABCD parameters is presented.Jarque-Bera test is made for the normality,and the worst-case estimation is given.Experimental results demonstrate that the proposed stochastic model and the statistical analysis method can evaluate the transmission performance of interconnects in the presence of process variations effectively. |
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| Keywords: | interconnects telegrapher s equation stochastic modeling stochastic differential equation Monte Carlo method |
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