| 铜丝键合在实际应用中的失效分析 |
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| 引用本文： | 张垠,方建明,陈金涛,朱彬若,江剑峰,陈选龙. 铜丝键合在实际应用中的失效分析[J]. 半导体技术, 2019, 44(8): 647-651 |
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| 作者姓名： | 张垠 方建明 陈金涛 朱彬若 江剑峰 陈选龙 |
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| 作者单位： | 国网上海市电力公司电力科学研究院,上海,200437;工业和信息化部电子第五研究所,广州 510610;中国赛宝实验室可靠性研究分析中心,广州 510610 |
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| 基金项目： | 广州市科技计划项目(201707010498);国网上海市电力公司科技项目(520940180021) |
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| 摘 要： | 研究并总结了铜丝键合塑封器件在实际应用环境中工作时发生的几种不同失效模式和失效机理,包括常见封装类型电路的失效,这些封装类型占据绝大部分铜丝键合的市场比例。和传统的实验室可靠性测试相比,实际应用中的铜丝失效能够全面暴露潜在可靠性问题和薄弱点,因为实际应用环境存在更多不可控因素。实际应用时的失效或退化机理主要包括:外键合点氯腐蚀、金属间化合物氯腐蚀、电偶腐蚀、键合弹坑、封装缺陷五种类型。对实际应用中的数据和分析为进一步改善铜丝键合可靠性、提高器件稳定性提供了依据。
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| 关 键 词： | 铜铝键合 电偶腐蚀 失效分析 铜丝失效 塑封集成电路 |
Failure Analysis of Copper Wire Bonding in Practical Applications |
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| Zhang Yin,Fang Jianming,Chen Jintao,Zhu Binruo,Jiang Jianfeng,Chen Xuanlong. Failure Analysis of Copper Wire Bonding in Practical Applications[J]. Semiconductor Technology, 2019, 44(8): 647-651 |
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| Authors: | Zhang Yin Fang Jianming Chen Jintao Zhu Binruo Jiang Jianfeng Chen Xuanlong |
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| Affiliation: | (Electric Power Research Institute,SMEPC,Shanghai 200437,China;The 5th Electronics Research Institute,Ministry of Industry and Information Technology,Guangzhou 510610,China;Reliability Research and Analysis Centre,China CEPREI Laboratory,Guangzhou 510610,China) |
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| Abstract: | Several different failure modes and mechanisms of copper wire bonding plastic encapsulated devices in actual application environment were studied and summarized, including the failure of common package type circuits which account for the majority of the copper wire bonding market. Compared with the conventional laboratory reliability tests, copper wire failures in practical applications can comprehensively reveal the potential reliability issues and weaknesses, because the actual application condition is not fully under control. The failure or degradation mechanisms in practical applications mainly include five types: chloride corrosion of external bonding, chloride corrosion of intermetallic compounds, galvanic corrosion, bonding cratering and package defects. The analysis of the data in practical applications provides an evidence for the further improvement of copper wire bonding reliability and device stability. |
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| Keywords: | Cu-Al bonding galvanic corrosion failure analysis copper wire failure plastic encapsulated integrated circuit |
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