| 优化试验法在化学镀铜工艺研究中的应用 |
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| 引用本文： | 何为,吴婧,夏建飞,张敏,王守绪,胡可,毛继美.优化试验法在化学镀铜工艺研究中的应用[J].实验科学与技术,2010,8(2):35-38. |
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| 作者姓名： | 何为 吴婧 夏建飞 张敏 王守绪 胡可 毛继美 |
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| 作者单位： | 1. 电子科技大学微电子与固体电子学院,成都,610054
2. 珠海元盛电子科技股份有限公司技术中心,广东,珠海,519060 |
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| 基金项目： | 粤港关键领域重点突破项目 |
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| 摘 要： | 在现代印制电路原理与工艺课程的教学中，化学镀铜是基本内容之一。文章采用RF-4为基材，研究了优化试验设计在次亚磷酸钠为还原剂的化学镀铜工艺研究中的应用。实验获得Na2H2PO2化学镀铜的最佳工艺参数为：次亚磷酸钠50．0g·dm^-1；硫酸镍1．0g·dm^-1；硼酸30．0g·dm^-1；酒石酸钾钠20．0g·dm^-1；五水硫酸铜10．0g·dm^-1；pH值6；温度55℃。
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| 关 键 词： | 化学镀铜 次亚磷酸钠 印制电路 表面修饰 |
Applied of Optimizing Tests in Technology Researched of the Electroless Copper of Sodium Hypophosphite |
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| HE Wei,WU Jing,XIA Jian-fei,Zhang Min,WANG Shou-xu,HU Ke,MAO Ji-mei.Applied of Optimizing Tests in Technology Researched of the Electroless Copper of Sodium Hypophosphite[J].Experiment Science & Technology,2010,8(2):35-38. |
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| Authors: | HE Wei WU Jing XIA Jian-fei Zhang Min WANG Shou-xu HU Ke MAO Ji-mei |
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| Affiliation: | HE Wei1,WU Jing1,XIA Jian-fei1,Zhang Min1,WANG Shou-xu1,HU Ke2,MAO Ji-mei2(1.School of Microelectronics , Solid-state Electronics of University of Electronic Science , Technology of China,Chengdu 610054,China,2.Technology Center,Zhuhai Topsun Electronic Technology CO.,LTD,Zhuhai 519060,China) |
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| Abstract: | In the course teaching of advanced printed circuit board principle and technology, the electroless copper plating is basal knowledge. In this paper,, the application of the optimization of experimental design in technical study of the electroless copper plating of sodium hypophosphite was investigated. The optimal technological parameters of electroless copper plating were obtained. These parameters are as follows： Sodium Hypopbosphite 50. 0 g ·dm^-1 , nickel salt 1.0 g·dm^-1 , boric acid 30. 0 g ·dm^-1 , sodium potassium tartrate 20. 0 g·dm^-1 , copper sulfate pentahydrate 10. 0 g·dm^-1 , pH6, and temperature 55℃. |
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| Keywords: | electroless copper plating Sodium Hypophosphite printed circuit board surface modificatio |
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