a Central Road Research Institute, New Delhi, India
b Department of Applied Mechanics, Indian Institute of Technology, New Delhi, India
Abstract:
The grinding operation is considered to be equivalent to a moving band source of heat and mechanical load on the surface of a semi-infinite solid, producing very high temperature on the surface of the workpiece. The resulting temperature may result in high stress in the workpiece. It is thus desirable to be able to predict the stress levels expected during the grinding process.