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Creep–Fatigue Crack Growth Behavior of Pb-Containing and Pb-Free Solders at Room and Elevated Temperatures |
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| Authors: | Kittichai Fakpan Yuichi Otsuka Yoshiharu Mutoh Shunsuke Inoue Kohsoku Nagata Kazuya Kodani |
| Affiliation: | 1. Department of Materials Science, Nagaoka University of Technology, 1603-1 Kamitomioka, Nagaoka, 940-2188, Japan 2. Department of System Safety, Nagaoka University of Technology, 1603-1 Kamitomioka, Nagaoka, 940-2188, Japan 3. Department of Mechanical Engineering, Nagaoka University of Technology, 1603-1 Kamitomioka, Nagaoka, 940-2188, Japan 4. Toshiba Corporation, Toshiba-cho, 183-8511, Japan |
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| 本文献已被 SpringerLink 等数据库收录！ | |
