| 基于CZM法QFN器件热冲击载荷下的界面脱层研究 |
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| 引用本文： | 李莉,蒋海华. 基于CZM法QFN器件热冲击载荷下的界面脱层研究[J]. 电子工业专用设备, 2009, 38(5): 30-33 |
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| 作者姓名： | 李莉 蒋海华 |
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| 作者单位： | 桂林电子科技大学,机电工程学院,广西,桂林,541004;桂林电子科技大学,机电工程学院,广西,桂林,541004 |
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| 摘 要： | 引进内聚力模型（CZM）法，利于有限元软件MSC．Marc对热冲击栽荷下QFN器件各材料界面之间的脱层开裂情况进行了研究。并分析了不同Diepad厚度对器件脱层失效的影响。结果表明：脱层开裂均发生在各个界面的两端，并逐渐沿着界面向里扩展，Diepad与芯片粘结剂之间的界面最容易发生脱层开裂；Diepad厚度对器件的脱层开裂影响较大，增加Diepad厚度能较大幅度的提高QFN器件的抗脱层开裂能力。
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| 关 键 词： | SQFN 内聚力模型 Diepad 界面脱层 可靠性 |
Study on Interface Delamination of QFN under Thermal Shock Loading Based on CZM Method |
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| LI Li,JIANG Haihua. Study on Interface Delamination of QFN under Thermal Shock Loading Based on CZM Method[J]. Equipment for Electronic Products Marufacturing, 2009, 38(5): 30-33 |
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| Authors: | LI Li JIANG Haihua |
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| Affiliation: | LI Li,JIANG Haihua (Dept of Mechanical &Electronic Engineering,Guilin University of Electronic Technology,Guilin 541004,China) |
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| Abstract: | In this paper, Cohesive Zone Modeling (hereafter CZM) method was introduced to investigate interface delamination crack between materials of QFN under thermal shock loading through MSC. Marc software. And the structural parameters which influence the delamination failure obviously of the device was analyzed. The results show that the interface delamination crack occurred at the two ends of the interfaces,and gradually extended to the interior. The interface between Diepad and adhesive is most likely to occu... |
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| Keywords: | SQFN Diepad |
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