Resilient metal spring network silicone-matrix composite for separable interconnections |
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Authors: | Mingguang Zhu D. D. L. Chung |
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Affiliation: | (1) Composite Materials Research Laboratory, State University of New York at Buffalo, Box 604400, 14260-4400 Buffalo, NY |
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Abstract: | Resilient metal spring silicone-matrix conducting composites for separable interconnections in electronics were fabricated by the impregnation of silicone into a preform comprising randomly oriented C-shaped Cu-Be springs and a small proportion of Sn-Pb solder, which served to connect the springs at some of their intersections. Composites containing 6.1-9.8 vol.% total filler exhibited volume electrical resistivity 0.5-1.0 mΩ.cm and contact resistivity (with copper) 11-17 mΩ.cm2. A compressive stress of about 30 kPa was needed for the low contact resistivity to be reached. The volume 17-26% and the contact resistivity increased by 5% after heating in air at 130-150°C for seven days. Composites containing <9 vol.% total filler showed no stress relaxation for seven days at 6.0% strain. |
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Keywords: | Contact electrical resistivity composite materials copper springs increased by electrical resistivity three-dimensional interconnected network silicone matrix solder volume electrical resistivity |
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