大口径光学元件装夹转运结构设计及分析

为了实现大口径光学元件的安全装夹、转运,通过光学元件开槽与不开槽两种装夹方式的分析,得出开槽夹紧转运方式将带来微裂纹、应力集中、成本高等缺陷,提出了利用摩擦力克服光学零件的重力和惯性力的低应力装夹转运方案。通过对光学元件低应力夹紧结构设计,并利用有限元分析方法,得到不开槽装夹方式下,光学元件的最大主应力为1.11 MPa,最大切应力为0.73 MPa,远低于光学元件破坏的强度极限,且受力均匀,无应力集中现象。

Design and analysis of clamping transfer structure for large aperture optical element

In order to realize the clamping and transshipment of large aperture optical element,through the analysis of two types of clamping methods,it is concluded that the slotting clamping method brings defects such as microcracks,stress concentration and high cost.A low-stress clamping transport scheme that using friction overcomes the gravity and inertial forces of optical element is proposed.Through the design of the low-stress clamping structure and the use of finite element analysis method,the maximum main stress of the optical element is 1.11 MPa and the maximum shear stress is 0.73 MPa,which is much lower than the breaking strength limit of the optical element.The force is uniform,no stress concentration.