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Al2O3陶瓷Ti+Nb/Mo金属化对其与Kovar合金钎焊连接的组织和力学性能的影响
引用本文:辛成来,李宁,颜家振.Al2O3陶瓷Ti+Nb/Mo金属化对其与Kovar合金钎焊连接的组织和力学性能的影响[J].焊接学报,2018,39(9):45-48.
作者姓名:辛成来  李宁  颜家振
作者单位:四川大学 制造科学与工程学院, 成都 610065
基金项目:航空科学基金实验室类(01)资助项目(20100119003)
摘    要:采用磁控溅射在Al2O3陶瓷表面沉积了Ti+Nb/Mo金属层,实现了氧化铝陶瓷的金属化,并通过电镀镍提高了金属化效果.采用AgCu28钎料,实现了金属化Al2O3陶瓷与Kovar合金的可靠连接.通过扫描电子显微镜和能谱观察了钎缝的微观组织.结果表明,钎料与母材发生了明显的界面反应.Cu元素扩散进入Kovar合金,同时Ni元素扩散进入钎料的富铜区,从而促进AgCu/Kovar连接界面的形成;金属化层在Al2O3/AgCu钎料界面处,起到了关键作用,其中铌可以抑制脆性化合物形成,缓解残余应力.金属化层镀镍后,钎缝中AgCu共晶区明显,且钎缝较宽,对提高镀镍试样的钎焊接头强度有一定作用.

关 键 词:氧化铝陶瓷    金属化    钎焊    磁控溅射
收稿时间:2017/2/25 0:00:00

Investigation of brazing joints of Al2O3 ceramics to Kovar alloys by Ti+Nb/Mo metallization
XIN Chenglai,LI Ning,YAN Jiazhen.Investigation of brazing joints of Al2O3 ceramics to Kovar alloys by Ti+Nb/Mo metallization[J].Transactions of The China Welding Institution,2018,39(9):45-48.
Authors:XIN Chenglai  LI Ning  YAN Jiazhen
Affiliation:School of Manufacturing Science and Engineering, Sichuan University, Chengdu 610065, China
Abstract:Ti+Nb/Mo thin films were deposited onto Al2O3 ceramic by magnetron sputtering with a subsequent nickel-plating to ensure the robust brazing of Al2O3 ceramic to Kovar alloy using the filler of AgCu28. Microstructures of the metallization layer and the brazing joints of Al2O3/Kovar were investigated systematically by scanning electron microscopy (SEM) and energy dispersive X-ray (EDS). The results show that the interfacial reaction layers are created between filler alloys and base materials. Interdiffusion of Ni and Cu at the interface of AgCu/Kovar resulted in the formation of the reaction layer. The metallization layer plays an important role in hindering the formation of intermetallic compounds and relieving residual thermal stress at Al2O3/AgCu interface. In addition, the presence of eutectic region arising from nickel-plating can improve the thickness of the brazing seam and therefore a good bonding betweenAl2O3 ceramic and Kovar was achieved.
Keywords:Al2O3 ceramics  metallization  braze joint  magnetron sputtering
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