| 硅酮压敏胶生产工艺的研究 |
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| 引用本文： | 陈月辉,施克炜,黄晓斐. 硅酮压敏胶生产工艺的研究[J]. 绝缘材料, 2003, 36(4): 14-16 |
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| 作者姓名： | 陈月辉 施克炜 黄晓斐 |
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| 作者单位： | 1. 上海工程技术大学化学化工学院,上海,200065
2. 上海金张绝缘材料有限公司,上海,200032 |
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| 摘 要： | 用硅酮压敏胶与不同基材复合制造压敏胶带时，胶层厚度、交联剂的用量对剪切强度和剥离强度有影响，研究结果表明：胶层厚度为0．05～0．06mm，交联剂为硅酮树脂用量的2％～3％，固化条件为80℃，2min，180℃，5min时效果较佳。
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| 关 键 词： | 硅酮树脂 压敏胶 复合材料 剪切强度 |
| 文章编号： | 1009-9239(2003)04-0014-03 |
| 修稿时间： | 2003-04-05 |
Study of polyorganosiloxane press-sensitive adhesive producing process |
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| CHEN Yue hui ,SHI Ke wei ,HUANG Xiao fei. Study of polyorganosiloxane press-sensitive adhesive producing process[J]. Insulating Materials, 2003, 36(4): 14-16 |
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| Authors: | CHEN Yue hui SHI Ke wei HUANG Xiao fei |
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| Affiliation: | CHEN Yue hui 1,SHI Ke wei 2,HUANG Xiao fei 1 |
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| Abstract: | The influence of adhesive thickness and cross linked agent amount on adhesive property of polyorganosiloxane press sensitive adhesive is studied from the producing process.The composites with different substrates including PET,PI,PTFE films form different adhesive tapes. |
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| Keywords: | polyorganosiloxane press sensitive adhesive composite adhesive property |
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