| 单多晶太阳能硅片切割线痕问题研究 |
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| 引用本文： | 江国中,蒋云龙,王学军. 单多晶太阳能硅片切割线痕问题研究[J]. 电子工业专用设备, 2013, 42(1): 21-24 |
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| 作者姓名： | 江国中 蒋云龙 王学军 |
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| 作者单位： | 中国电子科技集团公司第四十五研究所,北京,100176 |
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| 摘 要： | 线痕是多线切割领域比较常见的问题之一,分类总结了各种线痕产生的原因,并提出了相应的解决方法。
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| 关 键 词： | 多线切割 线痕 产生原因 解决方法 |
Study On The Stria of Monocrystalline Silicon and Polycrystalline Silicon |
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| JIANG Guozhong , JIANG Yunlong , WANG Xuejun. Study On The Stria of Monocrystalline Silicon and Polycrystalline Silicon[J]. Equipment for Electronic Products Marufacturing, 2013, 42(1): 21-24 |
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| Authors: | JIANG Guozhong JIANG Yunlong WANG Xuejun |
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| Affiliation: | (The 45th Research Institute of CETC,Beijing 100176) |
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| Abstract: | Stria is a common problem in the area of muti-wire cutting, classifying summarized the engendering reason of varied stria, and putting forward corresponding solution. |
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| Keywords: | Muti-wire Cutting Stria Reason Solution |
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