| 硅片切割技术的现状和发展趋势 |
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| 引用本文： | 王小军,孙振亚.硅片切割技术的现状和发展趋势[J].珠宝科技,2011(6):19-23. |
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| 作者姓名： | 王小军 孙振亚 |
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| 作者单位： | [1]武汉理工大学理学院,湖北武汉430070 [2]武汉理工大学材料研究与测试中心,湖北武汉430070 |
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| 基金项目： | 国家自然科学基金（编号：40672028） |
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| 摘 要： | 随着太阳能技术和半导体技术的飞速发展,对硅片的直径,厚度和精度提出了更高的要求,传统的硅片加工方式已经不能满足需要。文章分析内圆切割、多线切割、电火花钱切割和超声振动切割四种硅片切割方式,指出多线切割是硅片的主要切割方式,电火花线切割硅片技术有很大的发展潜力,超声振动切割优于其它三种硅片切割方式。
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| 关 键 词： | 硅片 超硬材料 综述 多线切割 电火花线切割 超声振动切割 |
Research situation and development trends of silicon wafer cutting technology |
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| WANG Xiao-jun,SUN Zhen-ya.Research situation and development trends of silicon wafer cutting technology[J].Jewellery Science and Technology,2011(6):19-23. |
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| Authors: | WANG Xiao-jun SUN Zhen-ya |
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| Affiliation: | 1.School of Science,Wuhan University of Technology,Wuhan 430070,China; 2.Center for Materials Research and Analysis,Wuhan University of Technology,Wuhan 430070,China) |
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| Abstract: | With the rapid development of solar energy technology and semiconductor technology,the traditional silicon processing methods can＇t meet the requirements in diameter,thickness and precision of silicon wafer.This paper discusses the characteristics and common methods of cutting silicon wafer including inner circle cutting,multi-wire cutting,electrical discharge machining and ultrasonic vibration cutting.It points out that the main way for cutting silicon wafer is multi-wire cutting,the electrical discharge machining has great potential to development,the ultrasonic vibration cutting is better than the other three silicon wafer cutting methods. |
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| Keywords: | silicon wafer superhard material summarizing multi-wire cutting electrical discharge machining ultrasonic vibration cutting |
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