SiC颗粒尺寸对SiCp/Cu基复合材料热膨胀系数的影响

采用化学镀工艺制备了镀铜SiC微粉。化学镀工艺参数对该复合粉体的包覆行为影响较大。利用冷压成型和无压烧结技术制备了SiCp/Cu基复合材料，并对该复合材料的微观结构和热膨胀系数进行研究。结果表明：SiC颗粒分布较均匀，SiC颗粒与基体之间界面结合良好；随测量温度增加，SiCp/Cu基复合材料的线膨胀系数呈非线性增加；当SiCp体积分数相同时，减小SiCp颗粒尺寸有利于降低复合材料的热膨胀系数。

Effect of SiC particle size on thermal expansion coefficients of SiCp/Cu composites

The Cu-coated SiC powder was fabricated by chemical plating technology.The parameters of chemical plating process have great influence on the cladding effect.The SiCp/Cu composites were fabricated by cold press molding and pressure-less sintering technique,and the microstructure and thermal expansion coefficient of the SiCp/Cu composites were investigated.The results show that SiC particles are more uniformly distributed in the SiCp/Cu composites,and the interfaces are well bonded.With the measuring temperature increasing,the linear expansion coefficients of SiCp/Cu composites are nonlinearly increasing.When SiCp volume fraction is constant,the thermal expansion coefficients of SiCp/Cu composites will reduce as the size of SiC particle becomes finer.