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前驱体伪共沉淀法制备CSs(纳米碳球)/Cu触头材料及致密化工艺研究
引用本文:丁一,祝志祥,邵文柱,张璐,陈保安,张强,韩钰,陈新,王强.前驱体伪共沉淀法制备CSs(纳米碳球)/Cu触头材料及致密化工艺研究[J].功能材料,2019,50(9):9135-9141.
作者姓名:丁一  祝志祥  邵文柱  张璐  陈保安  张强  韩钰  陈新  王强
作者单位:全球能源互联网研究院有限公司先进输电技术国家重点实验室,北京 102209;全球能源互联网研究院有限公司电工新材料研究所,北京 102209;哈尔滨工业大学 材料科学与工程学院,哈尔滨 150001;哈尔滨工业大学 金属精密热加工重点实验室,哈尔滨 150001;国网山西省电力公司,太原,030001
基金项目:国家电网有限公司总部科技项目
摘    要:通过前驱体伪共沉淀法制备出第二相均匀弥散分布的CSs(纳米碳球)/Cu触头材料,通过研究制备工艺以及第二相含量对CSs/Cu复合材料微观组织结构、机械物理性能及接触电阻的影响规律,为高性能铜基低压电器触头材料设计原则提供理论依据。

关 键 词:CSS  均匀弥散  铜基触头材料  致密化  接触电阻

Preparation of CSs/Cu electrical contact materials by precursor pseudo coprecipitation method and research of densification
DING Yi,ZHU Zhixiang,SHAO Wenzhu,ZHANG Lu,CHEN Baoan,ZHANG Qiang,HAN Yu,CHEN Xin,WANG Qiang.Preparation of CSs/Cu electrical contact materials by precursor pseudo coprecipitation method and research of densification[J].Journal of Functional Materials,2019,50(9):9135-9141.
Authors:DING Yi  ZHU Zhixiang  SHAO Wenzhu  ZHANG Lu  CHEN Baoan  ZHANG Qiang  HAN Yu  CHEN Xin  WANG Qiang
Affiliation:(State Key Laboratory of Advanced Power Transmission Technology, Global Energy Interconnection Research Institute Co., Ltd., Beijing 102209, China;Department of Electrical Engineering New Materials, Global Energy Interconnection Research Institute Co., Ltd., Beijing 102209, China;School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China;National Key Laboratory of Precision Hot Processing of Metals, Harbin Institute of Technology, Harbin 150001, China;State Grid Shanxi Electric Power Company, Taiyuan 030001, China)
Abstract:In this project, the CSs/Cu electrical contact materials with the homogeneous dispersed backbone phase were prepared by precursor pseudo coprecipitation method. The influence of preparation processing and backbone phase content on the microstructure, mechanical and physical performances and contact resistance was studied. Theoretical basis of high-performing for the design principle of high performance copper based electrical contact material was provided.
Keywords:CSs  homogeneous dispersion  copper based contact materials  densification  contact resistance
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