首页 | 官方网站   微博 | 高级检索  
     

新型Al-Zn-Mg-Cu合金热变形组织演化
引用本文:张坤,臧金鑫,陈军洲,伊琳娜,汝继刚,康唯.新型Al-Zn-Mg-Cu合金热变形组织演化[J].材料工程,2017,45(1).
作者姓名:张坤  臧金鑫  陈军洲  伊琳娜  汝继刚  康唯
作者单位:1. 北京航空材料研究院,北京,100095;2. 北京航空材料研究院,北京100095;北京市先进铝合金材料及应用工程技术研究中心,北京100095;3. 中国商飞质量适航部,上海,200126
摘    要:采用Gleeble-1500D热力模拟试验机研究新型Al-Zn-Mg-Cu高强铝合金在变形温度为300~450℃,应变速率为0.001~10s~(-1)条件下的热变形组织演化。利用光学显微镜(OM)和透射电子显微镜(TEM)观察合金不同热变形条件下的组织形貌特征。结果表明:随着变形温度的升高和应变速率的减小,位错密度减小,亚晶粒尺寸增大;合金热压缩变形过程中主要的软化机制为动态回复和动态再结晶。变形温度为300~400℃时,主要发生动态回复;变形温度为450℃,应变速率为0.001~10s~(-1)时,软化机制以动态再结晶为主,存在晶界弓出、亚晶长大、亚晶合并3种再结晶形核机制。

关 键 词:Al-Zn-Mg-Cu高强铝合金  热压缩变形  微观组织  动态回复  动态再结晶

Microstructure Evolution of New Al-Zn-Mg-Cu Alloy During Hot Deformation
ZHANG Kun,ZANG Jin-xin,CHEN Jun-zhou,YI Lin-na,RU Ji-gang,KANG Wei.Microstructure Evolution of New Al-Zn-Mg-Cu Alloy During Hot Deformation[J].Journal of Materials Engineering,2017,45(1).
Authors:ZHANG Kun  ZANG Jin-xin  CHEN Jun-zhou  YI Lin-na  RU Ji-gang  KANG Wei
Abstract:Microstructure evolution during hot deformation of a new Al-Zn Mg-Cu alloy was investigated by Gleeble-1500D thermal mechanical simulator at 300-450℃ and strain rate of 0.001-10s-1.The microstructure features at different hot deformation conditions were analyzed with optical microscope (OM) and transmission electron microscope (TEM).The results show that the dislocation density decreases and the subgrain sizes increase with the increase of deformation temperature and the decrease of the strain rate;the main softening mechanism of the alloy is dynamic recovery and dynamic recrystallization.Only dynamic recovery occurs when the temperature is 300-400℃.Dynamic recrystalliza tion occurs when the strain rate is 0.001-10s 1 at 450℃.The nucleation mechanism is grain boundary bowing,subgrain growing and subgrain incorporation during dynamic recrystallization.
Keywords:Al-Zn-Mg-Cu high strength alloy  hot compression deformation  microstructure  dynamic recovery  dynamic recrystallization
本文献已被 CNKI 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司    京ICP备09084417号-23

京公网安备 11010802026262号