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Whisker mitigation measures for Sn-plated Cu for different stress tests |
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| Authors: | L. Sauter A. Seekamp Y. Shibata Y. Kanameda H. Yamashita |
| Affiliation: | 1. Robert Bosch GmbH, Dieselstraße 6, D-72770 Reutlingen, Germany;2. Toyota Motor Cooperation, 1 Toyota-cho, Toyota, Aichi 471-8572, Japan;3. Bosch Cooperation, 6-7, Shibuya 3-chome, Shibuya-ku, Tokyo 150-8360, Japan;1. Department of Materials Science and Engineering, Korea University, Seoul 136-713, Republic of Korea;2. LED Division, LG Innotek Co., Ltd., Paju-city 413-901, Republic of Korea;1. Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland;2. Mentor Graphics, Mechanical Analysis Division, Budapest, Hungary;1. Department of Physics, Harbin Institute of Technology, Harbin 150001, People’s Republic of China;2. Aerospace Research Institute of Special Materials and Processing Technology, Beijing 100074, People’s Republic of China |
| Abstract: | The effectiveness of the widely-used whisker mitigation measures for Sn-plated Cu base material (annealing at 150 °C for 1 h or a Ni interlayer) were investigated after temperature cycling and after storage at room temperature. It was found that these measures prevent whisker growth during isothermal storage, but not during temperature cycling. These mitigation measures do apparently not reduce the compressive stress that builds up during temperature cycling due to different coefficients of thermal expansion of Sn and Cu. A change of the Sn microstructure to globular grains is proposed and investigated as potential whisker mitigation measure for temperature cycling. |
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