基于分子动力学的单晶硅纳米振动切削过程

为了研究脆性材料单晶硅原子级的纳米振动切削加工去除机制，应用分子动力学，通过改变刀具椭圆振动切削的模式，进行单晶硅纳米振动切削仿真．仿真结果表明，主切削力和法向力的变化趋势总体上呈现正弦曲线变化，并且已加工表面不同深度的亚表层存在残余应力；同时在不同切削模式下，由于刀具法向的振幅增加，使得法向力和残余应力增大；当刀具通过已加工表面时，残余应力随着亚表层深度降低而减弱；刀具法向振幅高于主切削力方向振幅时，法向力峰值高于主切削力峰值，已加工表面亚表层没有明显驰豫现象．

Nano-Vibration Cutting Process of Single Crystal Silicon by Molecular Dynamics

To investigate the nano-vibration cutting removal mechanisms of brittle material single crystal silicon at an atomic level, molecular dynamics (MD) simulation was carried out through changing the tool elliptical vibration modes. The simulation results show that the principal cutting force and thrust force vary following a similar sinusoid and there are residual stress in the machined sub-surfaces with different depths. The thrust force and residual stress enhance with the increase of amplitude in thrust direction. The residual stress reduces gradually with the decrease of depth of sub-surface after the tool passes away the machined surface. When the amplitude in thrust direction is greater than that in principal direction, the maximum thrust force is bigger than the maximum principal cutting force and there are not obvious relaxation phenomena in sub-surface.