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Measuring the fracture toughness of ultra-thin films with application to AlTa coatings
Authors:Yong Xiang  James McKinnell  Wie-Ming Ang  Joost J. Vlassak
Affiliation:(1) School of Engineering and Applied Sciences, Harvard University, 29 Oxford Street, Cambridge, MA 02138-2901, USA;(2) Present address: Intel Corporation, 3065 Bowers Avenue, MS SC2-24, Santa Clara, CA 95054, USA;(3) Technology Development Organization, Hewlett-Packard, 1000 NE Circle Blvd., Corvallis, OR 97330-4239, USA
Abstract:An experimental technique is presented for measuring the fracture toughness of brittle thin films. In this technique, long rectangular membranes are fabricated from the film of interest using standard silicon micromachining techniques. A focused ion beam is then used to introduce pre-cracks of different lengths along the centerline of the membranes and the membranes are pressurized until rupture. The fracture stress of the membrane is measured as a function of pre-crack length and the fracture toughness of the film is determined from a simple fracture mechanics analysis. The technique is applicable to a wide range of materials and is especially suited for ultra-thin films. We have demonstrated the experimental procedure for a 150 nm AlTa intermetallic film and obtained a room-temperature fracture toughness of K 1c = 4.44 ± 0.21 MPam1/2.
Keywords:Thin films  Bulge test  Fracture toughness
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