陶瓷外壳内部气氛和多余物对产品性能的影响

陶瓷外壳内部气氛、多余物对器件会造成致命的影响。陶瓷外壳封装芯片后,其内部残余气氛的状况对元器件的性能、寿命和可靠性影响很大,很容易造成元器件的性能低劣和早期失效。陶瓷外壳多余物,即便是非导电多余物,对元器件也会造成影响,可导致光电器件信号传递和继电器触点的不导通。文章通过分析陶瓷外壳内部残余气氛对元器件的影响及影响因素,陶瓷外壳烧结过程、电镀过程造成的水汽及解决办法,陶瓷外壳多余物对元器件的影响等,指出了解决问题的方向和办法,对提高产品质量有一定的意义。

The Internal Atmosphere of Ceramic Shell and Extra Material Impact on Product Performance

Ceramic shell internal atmosphere, extra material impact on the deadly devices. After the ceramic shell chip package, the internal state of the residual atmosphere of the performance of components, a great influence on the life and reliability, it is likely to cause poor performance and early component failure. Ceramic shell extra material, even if the excess non-conductive material, the components will be affected. Signaling can lead to optoelectronic devices and relay contacts not conducting. Based on the ceramic housing components within the residual atmosphere on the impact and influence factors; sintered ceramic shell process, electroplating process caused by water vapor and solutions; ceramic shell extra material on the components to analyze the impact that the resolution of the problem and methods to improve the quality of products have a certain significance.