微型机械运动副模内微组装成型热流固耦合变形模拟

提出了一种新型规模化高效低成本聚合物微型机械系统模内微组装成型加工技术，并针对其成型过程特点，建立了描述模内微组装成型过程成型热流固耦合变形机理的理论模型。通过有限元数值模拟，研究了模壁温度对模内微组装成型过程的影响规律。结果表明，模内微组装成型的微装配加工精度受控于热流固耦合压力场和不均匀温度场，且其热流固耦合变形随着模壁温度的升高而增大；减小模壁温度有利于提高其微装配加工精度。

Numerical Simulation on Thermal-fluid-structure Coupling Deformation of Polymer Micromechanical Motion Pair In-mold Micro Assembly Molding Process

A mechanical system for in mold micro assembly molding was proposed. A theoretical model was formulated to describe the mechanism of thermal fluid structure coupling deformation in polymer in mold micro assembly molding. Through finite element numerical simulation, the influence of the die wall temperature on the in mold micro assembly was studied. It was found that the micro assembly was controlled by its thermal fluid structure coupling pressure field and inhomogeneous temperature field, and its micro assembly thermal fluid structure coupled deformation increased with increasing die wall temperature. Reducing of die wall temperature would help improve its micro assembly molding precision.