| 多层陶瓷外壳的失效分析和可靠性设计 |
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| 引用本文： | 汤纪南. 多层陶瓷外壳的失效分析和可靠性设计[J]. 电子与封装, 2006, 6(10): 22-26 |
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| 作者姓名： | 汤纪南 |
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| 作者单位： | 江苏省宜兴电子器件总厂,江苏,宜兴,214221 |
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| 摘 要： | 文章对多层陶瓷外壳的失效模式,包括陶瓷底座断裂失效、绝缘电阻失效、断路和短路失效、外引线和无引线外壳引出端焊盘与外电路连接失效、电镀层锈蚀失效、密封失效、键合和芯片剪切失效和使用不当造成失效等进行讨论,并对这些失效的失效机理进行了分析,根据以上的失效模式及其失效机理分析,对多层陶瓷外壳的可靠性设计进行了探讨。
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| 关 键 词： | 多层陶瓷外壳 失效模式 失效机理 可靠性设计 |
| 文章编号： | 1681-1070（2006）10-0022-05 |
| 收稿时间： | 2006-03-17 |
| 修稿时间： | 2006-03-17 |
Invalidation Analysis and Reliability Design of Multilayer Ceramic Package |
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| TANG Ji-nan. Invalidation Analysis and Reliability Design of Multilayer Ceramic Package[J]. Electronics & Packaging, 2006, 6(10): 22-26 |
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| Authors: | TANG Ji-nan |
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| Affiliation: | Electronic Apparatus Factory of Yixing , Yixing 214221, China |
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| Abstract: | In this paper, mainly analysis the multi-layer ceramic package invalidation mode, including the ceramic base rupture invalidation, insulation resistance invalidation, open circuit and short circuit, leads terminal solder pad which leaded by outer down-leader or without down-leader connected with the external circuit invalidation, electroplating layer corrosion invalidation, seal invalidation, chip bonding and shear invalidation and invalidation caused by improper use, and so on, And analysis these invalidation mechanism, Based on the analysis of the invalidation mechanism and invalidation mode, the reliability of multilayer ceramic package design was discussed in the paper. |
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| Keywords: | multilayer ceramic package invalidation mode invalidation mechanism reliability design |
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