压电智能板热效应分析模型的建立与仿真

通过有限元分析方法研究了压电智能板结构的热效应问题。采用了包含4个位移节点、2个电势节点和8个温度节点的有限元模型,其位移场按壳单元模型描述,电势场和温度场则按线性插值方法描述。基于虚功原理导出了热机电有限元方程,分析了温度场的改变对压电智能板结构动力特性、动力响应和输出电压的影响。通过一悬臂智能板结构的数值仿真,反映出温度变化造成的物理参数值改变对位移响应和输出电压具有一定的影响;温度变化产生的热载荷对动力响应和输出电压具有非常大的影响,表明了在智能板结构响应分析中考虑热因素的重要性。

Thermal Effect Modelling of Intelligent Plate and Its Simulation

Thermal effects of piezoelectric intelligent plate are studied by finite element method. A finite element model including 4 displacement nodes, 2 electric potential nodes, and 8 temperature nodes is presented in this model. The displacement field is defined by plane shell element model; the electric potential field and temperature field are all defined by means of linear interpolation. The detailed element equations are deduced by using virtual work principle. The thermal influences on dynamic characteristics, displacement response, and output voltage are analyzed. The simulation of a intelligent cantilever plate shows that the thermal effect should be considered in the response analysis of intelligent plate.