| 纯铜双层辉光离子渗镍研究 |
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| 引用本文： | 袁庆龙,苏永安,徐重.纯铜双层辉光离子渗镍研究[J].真空科学与技术学报,2004,24(1):40-42. |
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| 作者姓名： | 袁庆龙 苏永安 徐重 |
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| 作者单位： | 太原理工大学表面工程研究所,山西太原,030024 |
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| 摘 要： | 介绍了采用双层辉光离子渗金属技术在纯铜表面制备Cu-Ni合金层的新方法,讨论了Cu-Ni合金层的组织、成分和性能特点,分析了辉光放电条件、源极溅射率及表面金属势对Cu-Ni合金层形成过程的影响.试验结果表明渗层厚度及渗层质量与辉光放电条件有关,在保证渗金属温度的前提下,应尽可能提高源极电压,降低试件电压.此外,该工艺还具有渗速快、效率高、无污染等优点.
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| 关 键 词： | 纯铜 双层辉光 离子表面合金化 |
| 文章编号： | 1672-7126(2004)01-0040-03 |
| 修稿时间： | 2003年4月2日 |
Surface Alloying of Nickel on Copper Substrate by Double Glow Discharge |
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| Yuan Qinglong,Su Yongan and Xu Zhong.Surface Alloying of Nickel on Copper Substrate by Double Glow Discharge[J].JOurnal of Vacuum Science and Technology,2004,24(1):40-42. |
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| Authors: | Yuan Qinglong Su Yongan and Xu Zhong |
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| Affiliation: | Yuan Qinglong,Su Yongan and Xu Zhong * |
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| Abstract: | A novel technique has been successfully developed to deposit nickel on copper surfaces to grow Ni Cu alloy layers with double glow discharge.Properties of the alloyed surface layers of Ni Cu,including its stoichiometry,its structures,and its erosion resistance were studied.Experimental factors affecting the surface alloying,such as glow discharge parameters,sputtering rate of Ni and the bias of the target,were studied also.The results show that high bias voltage of Ni target and low bias of copper substrates yield better results.The advantages of the technique include fairly fast growth speed,high efficiency and pollution free,etc. |
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| Keywords: | Pure copper Double glow discharge Plasma surface alloying |
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