| 化学机械抛光过程中扭矩的模型分析与试验研究 |
| |
| 引用本文： | 郭东明,徐驰,康仁科,金洙吉.化学机械抛光过程中扭矩的模型分析与试验研究[J].半导体学报,2011,32(3):036002-5. |
| |
| 作者姓名： | 郭东明 徐驰 康仁科 金洙吉 |
| |
| 作者单位： | 精密与特种加工教育部重点实验室,精密与特种加工教育部重点实验室,精密与特种加工教育部重点实验室,精密与特种加工教育部重点实验室 |
| |
| 基金项目： | Project supported by the Joint Fund of NSFC with Guangdong Province,China（No.U0734008）;;the National Science and Technology Major Project of China（No.2009ZX02011） |
| |
| 摘 要： | 提出了一个计算化学机械抛光（Chemical Mechanical Polishing，CMP）过程中硅片所受扭矩的模型，并通过CMP过程中摩擦力和扭矩的在线检测试验进行了验证。试验结果表明该扭矩计算模型可以较好地描述CMP过程中硅片所受扭矩的特征。该研究可以为基于抛光头旋转轴扭矩变化的CMP终点检测方法提供理论依据。
|
| 关 键 词： | 摩擦力矩 模型分析 检测实验 CMP 制程 化学机械抛光 过程模型 转动力矩 |
| 收稿时间： | 8/9/2010 9:50:07 AM |
| 修稿时间： | 9/27/2010 7:00:21 PM |
Model analysis and experimental investigation of the friction torque during the CMP process |
| |
| Guo Dongming,Xu Chi,Kang Renke and Jin Zhuji.Model analysis and experimental investigation of the friction torque during the CMP process[J].Chinese Journal of Semiconductors,2011,32(3):036002-5. |
| |
| Authors: | Guo Dongming Xu Chi Kang Renke and Jin Zhuji |
| |
| Affiliation: | Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China;Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China;Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China;Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China |
| |
| Abstract: | A model for calculating friction torque during the chemical mechanical polishing (CMP) process is presented, and the friction force and torque detection experiments during the CMP process are carried out to verify the model. The results show that the model can well describe the feature of friction torque during CMP processing. The research results provide a theoretical foundation for the CMP endpoint detection method based on the change of the torque of the polishing head rotational spindle. |
| |
| Keywords: | CMP friction torque endpoint detection |
| 本文献已被 维普 等数据库收录！ |
| 点击此处可从《半导体学报》浏览原始摘要信息 |
|
点击此处可从《半导体学报》下载全文 |
