| 印刷电路板焊点的智能检测 |
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| 引用本文： | 谢宏威,张宪民,邝泳聪,欧阳高飞.印刷电路板焊点的智能检测[J].光学精密工程,2011,19(9):2154-2162. |
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| 作者姓名： | 谢宏威 张宪民 邝泳聪 欧阳高飞 |
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| 作者单位： | 华南理工大学机械与汽车工程学院,广东广州,510640 |
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| 基金项目： | 国家杰出青年科学基金资助项目(No.50825504); 广东省科技攻关重点项目(No.2008A010300002); 中央高校基本科研业务费专项资金资助项目(No.2009ZM00731,No.2009ZM0132) |
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| 摘 要： | 为了提高在线自动光学检测系统(AOI)的自动化程度,提出了一种基于增量聚类的智能焊点检测方法.首先,设计了在线智能AOI的系统框架.然后,根据焊点外观进行归纳分类,将关键子区域的面积特征应用于焊盘特征的量化与提取,将每类样本聚类为若干子类从而实现对多批次焊点的检测.最后,提出一种增量聚类算法,在线检测过程中系统可根据人...
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| 关 键 词： | 自动光学检测 增量聚类 分类器 印刷电路板 焊点检测 |
Intelligent detection of solder joints on printed circuit boards |
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| XIE Hong-wei,ZHANG Xian-min,KUANG Yong-cong,OUYANG Gao-fei.Intelligent detection of solder joints on printed circuit boards[J].Optics and Precision Engineering,2011,19(9):2154-2162. |
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| Authors: | XIE Hong-wei ZHANG Xian-min KUANG Yong-cong OUYANG Gao-fei |
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| Affiliation: | XIE Hong-wei,ZHANG Xian-min*,KUANG Yong-cong,OUYANG Gao-fei (School of Mechanical and Automotive Engineering,South China University of Technology,Guangzhou 510640,China) |
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| Abstract: | To automate present Automatic Optical Inspection(AOI) systems,an intelligent method based on incremental clustering for solder joint inspection is proposed in this paper.Firstly,to meet the demands of practical production,the framework for an intelligent AOI system is designed.Then,all the defects of solder joints are classified into several different types according to their appearances,and the color features in critical regions are extracted.The samples in each class are clustered into several subclasses ... |
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| Keywords: | automatic optical inspection incremental clustering classifier printed circuit board solder joint inspection |
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